Epoxy resin composition

ABSTRACT

Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a National Stage of International Application No. PCT/JP2018/000192 filed Jan. 9, 2018, claiming priority based on Japanese Patent Application No. 2017-002211 filed Jan. 10, 2017.

TECHNICAL FIELD

The present invention relates to an epoxy resin composition. The present invention also relates to a method for producing the composition, use of the composition, etc.

BACKGROUND ART

Epoxy resins, which are a type of thermosetting resin, are used in various fields, such as electric and electronic materials, coating compositions, adhesives, and composite materials, because cured products thereof have excellent heat resistance, electrical insulating properties, and like characteristics. Particularly in the field of electric and electronic materials, epoxy resins are used in semiconductor sealing materials, printed circuit board materials, etc.

The frequency of transmission signals has recently increased along with an increase in the performance of electronic devices and a reduction in the weight and size thereof. In accordance with the increased frequency, materials used in printed circuit boards and semiconductor sealing materials are strongly required to have a lower dielectric constant in the high frequency region. In this field, thermosetting resins, such as epoxy resins, are widely used as substrate materials or sealing materials. PTL 1 discloses that an epoxy resin composition containing a polyphenylene ether has low dielectric characteristics. PTL 2 discloses an epoxy resin containing a silicon atom.

CITATION LIST Patent Literature

-   PTL 1: JP2004-231728A -   PTL 2: GB1123960B

SUMMARY OF INVENTION Technical Problem

In PTL 1, the various characteristics of specific epoxy resin cured products are improved using a polyphenylene ether as a curing agent, but are still not sufficient.

Accordingly, an object of the present invention is to provide an epoxy resin composition having excellent low dielectric characteristics.

Solution to Problem

As a result of extensive research to solve the above problem, the present inventors found that an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific chemical structure has excellent low dielectric characteristics. The present invention has been completed upon further studies.

The present invention includes the main subjects shown below.

Item 1. An epoxy resin composition comprising an epoxy resin and a polyphenylene ether, the epoxy resin being represented by the formula (1):

wherein X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, or in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected;

R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyl group, a halogen atom, or a group represented by the formula (3):

wherein R¹ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

R² is a C₁₋₁₈ alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

R³ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

m is an integer of 0 to 6; and

n is an integer of 0 to 3;

-   provided that at least one of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) is     a group represented by the formula (3); and -   one or more hydrogen atoms bonded to one or more carbon atoms that     constitute the hydrocarbon ring constituting the X ring, and that     are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced     by a lower alkyl group, a lower alkoxy group, a lower alkenyl group,     or a halogen atom.

Item 2. The epoxy resin position according to Item 1, wherein the rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected are rings represented by the formula (2):

wherein X¹ ring and X² ring are the same or different, and each is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring; and

Y is a bond, a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO₂—.

Item 3. The epoxy resin composition according to Item 1 or 2, wherein the saturated hydrocarbon ring is a C₄₋₈ saturated hydrocarbon ring, and the unsaturated hydrocarbon ring is a C₄₋₈ unsaturated hydrocarbon ring.

Item 4. The epoxy resin composition according to Item 1, wherein the composition comprises a polyphenylene ether and at least one epoxy resin selected from the group consisting of: an epoxy resin represented by the formula (1-iia):

wherein X^(ii) is a divalent group obtained by removing two hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a divalent group represented by the formula (2^(g)-iia)

wherein Y is a bond, a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO₂—;

R¹ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

R² is the same or different, and is a C₁₋₁₈ alkylene group, wherein one or more carbon atoms of his group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

R³ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;

m is an integer of 0 to 6; and

n is an integer of 0 to 3; and

an epoxy resin represented by the formula (1-iiia):

wherein X^(iii) is a trivalent group obtained by removing three hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a trivalent group represented by the formula (2^(g)-iiia):

wherein Y is as defined above; and

R¹, R², R³, m, and n are as defined above.

Item 5. The epoxy resin composition according to any one of Items 1 to 4, wherein the polyphenylene ether has a molecular weight of 500 to 200000.

Item 6. The epoxy resin composition according to any one of items 1 to 5, wherein the polyphenylene ether has a reactive functional group equivalent of 200 to 5000 g/eq. Preferably, the epoxy resin composition according to Item 5, wherein the polyphenylene ether has a molecular weight of 500 or more and less than 5000, and a reactive functional group equivalent of 200 to 5000 g/eq.

Item 7. A cured product of the epoxy resin composition according to any one of Items 1 to 6.

Item 8. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to any one of Items 1 to 6 or the cured product according to Item 7.

Item 9. The epoxy resin composition according to any one of items 1 to 6 or the cured product according to Item 7 for use in a semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material.

Item 10. Use of the epoxy resin composition according to any one of Items 1 to 6 or the cured product according to Item 7 for producing a semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material.

Advantageous Effects of Invention

Because the epoxy resin composition of the present invention comprises an epoxy resin represented by the above formula (1) and a polyphenylene ether, a cured product thereof maintains good electric characteristics (low dielectric characteristics) and has high adhesive strength to metal. Therefore, the epoxy resin composition of the present invention can be suitably used for various applications, such as semiconductor sealing materials, liquid sealing materials, potting materials, sealing materials, interlayer insulation films, adhesive layers, coverlay films, electromagnetic shielding films, printed circuit board materials, and composite materials.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention are described in more detail below.

The epoxy resin composition contained in the present invention comprises an epoxy resin and a polyphenylene ether, the epoxy resin being represented by the formula (1):

In the formula (1), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyl group, a halogen atom, or a group represented by the formula (3):

(hereinafter also referred to as the “group of the formula (3)”). Hereinafter, a lower alkyl group, a lower alkoxy group, and a lower alkenyl group are also collectively referred to as “lower carbon substituents.” In the present invention, among the lower carbon substituents, a lower alkyl group or a lower alkoxy group is more preferable.

However, at least one of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) is a group of the formula (3). In other words, three of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are hydrogen atoms, halogen atoms, or lower carbon substituents, and the other one is a group of the formula (3); two of them are hydrogen atoms, halogen atoms, or lower carbon substituents, and the other two are groups of the formula (3); one of them is a hydrogen atom, a halogen atom, or a lower carbon substituent, and the other three are groups of the formula (3); or all of them are groups of the formula (3). More specifically, for example, R^(Xa), R^(Xb), R^(Xc), and R^(Xd) may be as follows:

-   (i) R^(Xa), R^(Xb), and R^(Xc) are hydrogen atoms, halogen atoms, or     lower carbon substituents, and R^(Xd) is a group of the formula (3); -   (ii) R^(Xa) and R^(Xb) are hydrogen atoms, halogen atoms, or lower     carbon substituents, and R^(Xc) and R^(Xd) are groups of the formula     (3); -   (iii) R^(Xa) is a hydrogen atom, a halogen atom, or a lower carbon     substituent, and R^(Xb), R^(Xc), and R^(Xd) are groups of the     formula (3); or -   (iv) all of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are groups of the     formula (3). Of R^(Xa), R^(Xb), R^(Xc), and R^(Xd), one or more     members that are not groups of the formula (3) are more preferably     hydrogen atoms or lower carbon substituents.

In the formula (1), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) may be the same or different. Therefore, when R^(Xa), R^(Xb), and R^(Xc) are hydrogen atoms, halogen atoms, or lower carbon substituents, and when R^(Xd) is a group of the formula (3), R^(Xa), R^(Xb), and R^(Xc) may be the same or different. (ii) When R^(Xa) and R^(Xb) are hydrogen atoms, halogen atoms, or lower carbon substituents, and when R^(Xc) and R^(Xd) are groups of the formula (3), R^(Xa) and R^(Xb) may be the same or different, and R^(Xc) and R^(Xd) may also be the same or different. (iii) when R^(Xa) is a hydrogen atom, a halogen atom, or a lower carbon substituent, and when R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3), R^(Xb), R^(Xc), and R^(Xd) may be the same or different. (iv) When all of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) may be the same or different. In any of these cases, the groups of the formula (3) are more preferably the same.

Moreover, when two or three of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are halogen atoms or lower carbon substituents, these halogen atoms or lower carbon substituents may also be the same or different. In this case, two or three of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are more preferably the same lower carbon substituents.

In the present specification, the lower carbon substituent refers to a lower alkyl group, a lower alkoxy group, or a lower alkenyl group. The term “lower” used herein means 1 to 6 (1, 2, 3, 4, 5, or 6) carbon atoms. Of the lower carbon substituents, a lower alkyl group or a lower alkoxy group is preferable. Specifically, preferable examples of lower alkyl groups include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, and the like. Preferable examples of lower alkoxy groups include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, an isobutoxy group, and the like.

Moreover, in the present specification, the halogen atom is a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom; preferably a fluorine atom, a chlorine atom, or a bromine atom; and more preferably a fluorine atom or a bromine atom.

In the formula (1), X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, or in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected. In the present specification, the saturated hydrocarbon ring is, for example, preferably a C₄₋₈ (4, 5, 6, 7, or 8) saturated hydrocarbon ring, and particularly preferably a cyclopentane ring, a cyclohexane ring, or the like. In the present specification, the unsaturated hydrocarbon ring is, for example, preferably a C₄₋₈ (4, 5, 6, 7, or 8) unsaturated hydrocarbon ring, and particularly preferably a benzene ring or the like. In the present specification, the rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed are preferably 2, 3, or 4 condensed saturated hydrocarbon rings and/or unsaturated hydrocarbon rings, and more preferably 2 or 3 condensed saturated hydrocarbon rings and/or unsaturated hydrocarbon rings. More specific examples include a decahydronaphthalene ring, an adamantine ring, a naphthalene ring, a phenanthrene ring, an anthracene ring, a pyrene ring, a triphenylene ring, a tetralin ring, 1,2,3,4,5,6,7,8-octahydronaphthalene ring, a norbornene ring, and the like.

In the present specification, a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, are also collectively referred to as “hydrocarbon rings.”

The rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected are preferably rings represented by the formula (2):

In the formula (2), X¹ ring and X² ring are the same or different, and each is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring. That is, the X¹ ring and X² ring are both saturated hydrocarbon rings or unsaturated hydrocarbon rings; or one of them is a saturated hydrocarbon ring, and the other is an unsaturated hydrocarbon ring. It is preferable that the X¹ ring and the X² ring be both saturated hydrocarbon rings or unsaturated hydrocarbon rings. For example, it is preferable that the X¹ ring and the X² ring be both benzene rings or cyclohexane rings, or that one of them be a benzene ring and the other be a cyclohexane ring; and it is more preferable that both of them be benzene rings.

Moreover, Y is a bond, a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO₂—. Examples of the C₁₋₆ alkylene group include a methylene group, an ethylene group, a trimethylene group, a tetramethylene group, a hexamethylene group, and the like. Moreover, examples of the C₁₋₄ alkyl group as a substituent include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, and the like. Preferable examples of the C₁₋₆ alkylene group substituted with a C₁₋₄ alkyl group include —CH(CH₃)—, —C(CH₃)₂—, —CH₂CH(CH₃)CH₂—, —CH₂C(CH₃)₂CH₂—, and the like. Y is preferably a bond, an oxygen atom, a methylene group, a dimethylmethylene group, —S—, or —SO₂—; and more preferably a bond, a dimethylmethylene group, an oxygen atom, or —SO₂—.

The rings represented by the formula (2) are substituted with R^(Xa), R^(Xb), R^(Xc), and R^(Xd). When the X ring of the formula. (1) is rings represented by the formula (2), when three of R^(Xa) to R^(Xd) are hydrogen atoms, halogen atoms, or lower carbon substituents, and when the other one is a group of the formula (3), one of the X¹ ring and X² ring may be substituted with a group of the formula (3). In this case, the rings represented by the formula (2) are substituted with 0, 1, 2, or 3 halogen atoms or lower carbon substituents, and (number of halogen atoms or lower carbon substituents substituted in X¹ ring: number of halogen atoms or lower carbon substituents substituted in X² ring) can be (1:0), (0:1), (2:0), (1:1), (0:2), (3:0), (2:1), (1:2), or (0:3). When two of R^(Xa) to R^(Xd) are hydrogen atoms, halogen atoms, or lower carbon substituents, and when the other two are groups of the formula (3), one of the X¹ ring and X² ring may be substituted with 2 groups of the formula (3), or the X¹ ring and the X² ring each may be substituted with a group of the formula (3). It is preferable that the X¹ ring and the X² ring each be substituted with a group of the formula (3). In this case, the rings represented by the formula (2) are substituted with 0, 1, or 2 halogen atoms or lower carbon substituents, and (number of halogen atoms or lower carbon substituents substituted in X¹ ring: number of halogen atoms or lower carbon substituents substituted in X² ring) can be (1:0), (0:1), (2:0), (1:1), or (0:2). When one of R^(Xa) to R^(Xd) is a hydrogen atom, a halogen atom, or a lower carbon substituent, and when the other three are groups of the formula (3), one of the X¹ ring and X² ring may be substituted with 3 groups of the formula (3); the X¹ ring may be substituted with 2 groups of the formula (3), and the X² ring may be substituted with 1 group of the formula (3); or the X¹ ring may be substituted with 1 group of the formula (3), and the X² ring may be substituted with 2 groups of the formula (3). It is preferable that the X¹ ring be substituted with 2 groups of the formula (3), and the X² ring be substituted with 1 group of the formula (3); or that the X¹ ring be substituted with 1 group of the formula (3), and the X² ring be substituted with 2 groups of the formula (3). In this case, the rings represented by the formula (2) are substituted with 0 or 1 halogen atom or lower carbon substituent, and (number of halogen atoms or lower carbon substituents substituted in X¹ ring: number of halogen atoms or lower carbon substituents substituted in X² ring) may be (1:0) or (0:1). When all of R^(Xa) to R^(Xd) are groups of the formula (3), one of the X¹ ring and the X² ring may be substituted with 4 groups of the formula (3); the X¹ ring may be substituted with 3 groups of the formula (3), and the X² ring may be substituted with 1 group of the formula (3); the X¹ ring may be substituted with 1 group of the formula (3), and the X² ring may be substituted with 3 groups of the formula (3); or the X¹ ring may be substituted with 2 groups of the formula (3), and the X² ring may be substituted with 2 groups of the formula (3). It is preferable that the X¹ ring be substituted with 2 groups of the formula (3), and the X² ring be substituted with 2 groups of the formula (3).

As a group of the formula (1), a tetravalent group represented by the formula. (1′):

wherein in the formula (1′). X ring is as defined above; is particularly preferably a group represented by the following formula. Specifically, the group is represented by the following formula:

wherein in the formula (2^(g)), Y is as defined above.

In the formula (3), R¹ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom (preferably an oxygen atom). The one or more carbon atoms are preferably carbon atoms that are not directly bonded to the silicon atom. The one or more carbon atoms that may be replaced are one or plural (e.g., 2, 3, 4, 5, or 6) carbon atoms, and preferably one carbon atom. In terms of ease of synthesis etc., it is preferable that R¹ bonded to the same silicon atom be the same. It is more preferable that ail R¹ present in the formula (1) be the same.

The C₁₋₁₈ alkyl group represented by R¹ is, for example, a linear or branched alkyl group. Examples include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, a neopentyl group, a tert-pentyl group, an n-hexyl group, an n-heptyl group, a 2,2,4-trimethylpentyl group, an n-octyl group, an isooctyl group, an n-nonyl group, an n-decyl group, an n-dodecyl group, and the like. Preferable is a C₁₋₁₀ alkyl group, more preferable is a alkyl group, even more preferable is a C₁₋₃ alkyl group, and particularly preferable is a methyl group.

The C₂₋₉ alkenyl group represented by R¹ is, for example, a linear or branched alkenyl group. Examples include a vinyl group, an allyl group, a 2-propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group, and the like. Preferable is a C₂₋₄ alkenyl group.

The cycloalkyl group represented by R¹ is, for example, a 3- to 8-membered ring cycloalkyl group. Examples include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a methylcyclohexyl group, and the like.

The aryl group represented by R¹ is, for example, a monocyclic or bicyclic aryl group. Examples include a phenyl group, a tolyl group, a xylyl group, an ethyl phenyl group, a naphthyl group, and the like. Preferable is a phenyl group.

The aralkyl group represented by R¹ is, for example, a C₁₋₄ alkyl group substituted with an aryl group (particularly a phenyl group). Examples include a benzyl group, an α-phenethyl group, a β-phenethyl group, a β-methylphenethyl group, and the like.

R¹ is preferably a C₁₋₃ alkyl group, and more preferably a methyl group.

In the formula (3), R² is a C₁₋₁₈ alkylene group. The alkylene group is a linear or branched alkylene group, and preferably a linear alkylene group. Examples include a methylene group, a methylmethylene group, an ethylmethylene group, a dimethylmethylene group, a diethylmethylene group, a dimethylene group (—CH₂CH₂—), a trimethylene group (—CH₂CH₂CH₂—), a tetramethylene group, a pentamethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, a decamethylene group, an undecamethylene group, a dodecamethylene group, a tridecamethylene group, and the like. Specific examples include a C₂₋₁₈ alkylene group, preferably a C₂₋₁₀ alkylene group, more preferably a C₂₋₈ alkylene group, even more preferably a C₂₋₆ alkylene group, and particularly preferably a C₂₋₅ alkylene group.

One or more carbon atoms of the C₁₋₄₈ alkylene group may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom (preferably an oxygen atom). The one or more carbon atoms are preferably carbon atoms that are not directly bonded to the silicon atom, and the 3- to 8-membered ring or epoxy ring. Moreover, the one or more carbon atoms that may be replaced are one or plural (e.g., 2, 3, 4, 5, or 6) carbon atoms, and preferably one carbon atom.

When the side of R² binding to the silicon atom, is expressed as (*), examples of this group include (*)—C₂₋₉ alkylene-O—C₁₋₈ alkylene-, preferably (*) C₂₋₄ alkylene-O—C₁₋₃ alkylene-, more preferably (*)—C₂₋₄ alkylene-O—C₁₋₂ alkylene-, and particularly preferably (*)—C₃ alkylene-O-methylene-.

Specific examples include (*)—(CH₂)₂—O—CH₂, (*)—(CH₂)₃—O—CH₂—, (*)—(CH₂)₃—O—(CH₂)₂, (*)—(CH₂)₅—O—(CH₂)₄—, and the like; of these, (*)—(CH₂)₃—O—CH₂ is preferable.

In the formula (3), m is an integer of 0 to 6 (i.e., 0, 1, 2, 3, 4, 5, or 6). Moreover, n is an integer of 0 to 3 (i.e., 0, 1, 2, or 3). The group bonded to R² of the formula (3) (on the side not binding to the silicon atom) is represented by the formula (4) (hereafter also referred to as “the group of the formula (4)”), as shown below.

The group of the formula (4) wherein m is an integer of 1 to 6 is specifically described by the following structural formulas.

When m is 0, only an epoxy ring remains, and n is an integer of 0 to 3; thus, the group of the formula (4) is a group represented by any of the following formulas:

In the formula (3), R² and R³ bind to a 3- to 8-membered ring or an epoxy ring. n represents the number of R³ binding to the 3- to 8-membered ring or the epoxy ring.

In the formula (3), R³ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group. One or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom. The one or more carbon atoms are preferably carbon atoms that are not directly bonded to the 3- to 8-membered ring or epoxy ring. Moreover, the one or more carbon atoms that may be replaced are one or plural (e.g., 2, 3, 4, 5, or 6) carbon atoms, and preferably one carbon atom.

Examples of the C₁₋₁₈ alkyl group, C₂₋₉ alkenyl group, cycloalkyl group, aryl group, and aralkyl group represented by R³ include the same corresponding substituents represented by R¹ described above.

R³ is preferably a C₁₋₃ alkyl group, and more preferably a methyl group or an ethyl group.

Preferable examples of the group of the formula (3) include groups wherein R¹, R², R³, m, and n are as defined above; all R¹ are the same; and all R³ are the same (when there are plural R³). The number of this group present in the epoxy resin represented by the formula (1) is 1, 2, 3, or 4; and they may be the same or different, and are preferably the same.

Particularly preferable specific examples of the group of the formula (4) include groups wherein R³ is as defined above; m is 0, 1, 2, 3, or 4; and n is 0, 1, or 2. More preferable among these are the following groups (all R³ are as defined above):

The number of groups of the formula (4) present in the epoxy resin represented by the formula (1) is 1, 2, 3, or 4; and they may be the same or different, and are preferably the same.

Moreover, one or more hydrogen atoms bonded to one or more carbon atoms that constitute the hydrocarbon ring constituting the X ring, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced by a lower carbon substituent or a halogen atom (preferably a lower carbon substituent). That is, when the X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, one or more hydrogen atoms bonded to one or more carbon atoms that constitute these rings, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced by a lower carbon substituent or a halogen atom (preferably a lower carbon substituent). When the X ring is rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected, one or more hydrogen atoms bonded to one or more carbon atoms that constitute theses connected saturated hydrocarbon rings and/or unsaturated hydrocarbon rings, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced by a lower carbon substituent or a halogen atom (preferably a lower carbon substituent). When the case in which the X ring is rings represented by the formula (2) is explained in detail, one or more hydrogen atoms bonded to one or more carbon atoms that constitute the X¹ ring and X² ring, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced by a lower carbon substituent or a halogen atom (preferably a lower carbon substituent).

In the present specification, carbon atoms that constitute the hydrocarbon ring constituting the X ring, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), and R^(Xd), are also referred to as “R^(Xa-d) non-binding carbon atoms.”

The lower carbon substituent or halogen atom that may replace one or more hydrogen atoms bonded to one or more R^(Xa-d) non-binding carbon atoms is preferably singly bonded to one R^(Xa-d) non-binding carbon atom. That is, when hydrogen atoms bonded to R^(Xa-d) non-binding carbon atoms are replaced, only one of the hydrogen atoms bonded to the R^(Xa-d) non-binding carbon atoms is preferably replaced by a lower carbon substituent or halogen atom. Moreover, the number of substituents (i.e., the total number of lower carbon substituents and halogen atoms) is more preferably less than the number of R^(Xa-d) non-binding carbon atoms. More specifically, the number of substituents is preferably 1 to 6 (1, 2, 3, 4, 5, or 6), more preferably 1 to 4, and even more preferably 1 or 2. Particularly when the X ring is rings represented by the formula (2), one or more hydrogen atoms to be replaced are preferably hydrogen atoms bonded to carbon atoms that are not bonded to Y.

When at least one of R^(Xa), R^(Xb), R^(Xc) and R^(Xd) is a lower carbon substituent, and when at least one lower carbon substituent is bonded to an R^(Xa-d) non-binding carbon atom, all of the lower carbon substituents are preferably the same. That is, when there are lower carbon substituents among R^(Xa), R^(Xb), R^(Xc), and R^(Xd), and when there are lower carbon substituents bonded to R^(Xa-d) non-binding carbon atoms, all of the lower carbon substituents are preferably the same. Moreover, although it is not particularly limited, when at least one of R^(Xa), R^(Xb), R^(Xc) and R^(Xd) is a halogen atom, and when at least one halogen atom is bonded to an R^(Xa-d) non-binding carbon atom, all of the halogen atoms are preferably the same. That is, when there are halogen atoms among R^(Xa), R^(Xb), R^(Xc), and R^(Xd), and when there are halogen atoms bonded to R^(Xa-d) non-binding carbon atoms, all of the halogen atoms are preferably the same.

More specifically, for example, when the tetravalent group represented by the above formula (1′) is the following:

preferable examples of the epoxy resin represented by the formula (1) include an epoxy resin represented by the formula (1-X1):

wherein in the formula (1-X1), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(Xg1) and R^(Xg2) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a lower alkenyl group.

In the formula (1-X1), R^(Xa), R^(Xb), R^(Xc), R^(Xd), R^(Xg1), and R^(Xg2) are more preferably each bonded to a different carbon atom on the benzene ring. Among the epoxy resins represented by the formula (1-X1), one wherein R^(Xg1) and are hydrogen atoms is preferable.

More preferable examples of the epoxy resin represented by the formula (1-X1) include:

an epoxy resin represented by the formula (1-X1a):

wherein in the formula (1-X1a), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(Xg1) and R^(Xg2) are as defined above; and an epoxy resin represented by the formula (1-X1b):

wherein in the formula (1-X1b), R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(Xg1) and R^(Xg2) are as defined above.

More preferable among the epoxy resins represented by the formula (1-X1a) are, for example, those wherein R^(Xa) and R^(Xb) are hydrogen atoms, R^(Xc) and R^(Xd) are groups of the formula (3), and R^(Xg1) and R^(Xg2) are hydrogen atoms; and those wherein R^(Xa) and R^(Xc) are hydrogen atoms, R^(Xb) and R^(Xd) are groups of the formula (3), and R^(Xg1) and R^(Xg2) are hydrogen atoms.

More preferable among the epoxy resins represented by the formula (1-X1b) are, for example, those wherein R^(Xa) is a hydrogen atom, R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3), and R^(Xg1) and R^(Xg2) are hydrogen atoms.

Moreover, when the tetravalent group represented by the above formula (1′) is a group represented by the following formula:

wherein in the formula (2), Y is as defined above; preferable examples of the epoxy resin represented by the formula (1) also include an epoxy resin represented by the formula (1-X2):

wherein in the formula (1-X2), Y is as defined above; R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(X11), R^(X12), and R^(X13), as well as R^(X21), R^(X22) and R^(X23) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a lower alkenyl group.

In the formula (1-X2), R^(Xa), R^(Xc), R^(X11), R^(X12), and R^(X13) preferably each bind to a different carbon atom; and R^(Xb), R^(Xd), R^(X21), R^(X22) and R^(X23) more preferably each bind to a different carbon atom. None of R^(Xa), R^(Xb), R^(Xc), R^(Xd), R^(X11), R^(X12), R^(X13), R^(X21), R^(X22), and R^(X23) binds to a carbon atom bonded to Y.

More preferable among the epoxy resins represented by the formula (1-X2) are:

an epoxy resin represented by the formula (1-X2a):

wherein in the formula (1-X2a), Y is as defined above; R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(X11), R^(X12) and R^(X13), as well as R^(X21), R^(X22), and R^(X23) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a lower alkenyl group;

an epoxy resin represented by the formula (1-X2):

wherein in the formula (1-X2b), Y is as defined above; R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are as defined above; and R^(X11), R^(X12), and R^(X13), as well as R^(X21), R^(X22), and R^(X23) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a lower alkenyl group; and

an epoxy resin represented by the formula (1-X2c)

wherein in the formula (1-X2c), Y is as defined above; R^(Xa), R^(Xb), R^(Xc), and R^(Xd), are as defined above; and R^(X11), R^(X12), and R^(X13), as well as R^(X21), R^(X22), and R^(X23) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, or a lower alkenyl group.

More preferable among the epoxy resins represented by the formula (1-X2a) are, for example, those wherein R^(Xa), R^(Xb)R^(Xc), and R^(Xd) are groups of the formula (3); R^(X11) and R^(X21) are lower carbon substituents; and R^(X12), R^(X13), R^(X22), and R^(X23) are hydrogen atoms. Particularly preferable are those wherein Y is a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group (particularly —C(CH₃)₂—); R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3); R^(X11) and R^(X21) are lower alkoxy groups; and R^(X12), R^(X13), R^(X22), and R^(X23) are hydrogen atoms. In these cases, it is more preferable that all of the groups of the formula (3) as R^(Xa), R^(Xb), R^(Xc), and R^(Xd) be the same, and that the lower carbon substituents as R^(X11) and R^(X21) be the same.

Preferable among the epoxy resins represented by the formula (1-X2b) are, for example, those wherein R^(Xa) and R^(Xb) are hydrogen atoms; R^(Xc) and R^(Xd) are groups of the formula (3); and R^(X11), R^(X12), R^(X13), R^(X21), R^(X22), and R^(X23) are hydrogen atoms. In this case, it is more preferable that the groups of the formula (3) as R^(Xc) and R^(Xd) be the same.

Preferable among the epoxy resins represented by the formula (1-X2c) are, for example, those wherein R^(Xa) is a hydrogen atom; R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3); and R^(X11), R^(X12), R^(X13), R^(X21), R^(X22), and R^(X23) are hydrogen atoms. In this case, it is more preferable that the groups of the formula (3) as R^(Xb), R^(Xc), and R^(Xd) be the same.

In the present specification, the explanations relating to the X ring, R^(Xa), R^(Xb), R^(Xc), and R^(Xd) the formula (1), and R¹, R², R³, m, and n in the group of the formula (3), including the explanation about the group of the formula (4), can be combined in any way. Any epoxy resins represented by combinations thereof can be also used in the present invention.

The formula (1) can satisfy any of the following:

-   (iia) one or more hydrogen atoms bonded to one or more R^(Xa-d)     non-binding carbon atoms are not replaced; R^(Xa) and R^(Xb) of     R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are hydrogen atoms; and R^(Xc)     and R^(Xd) are groups of the formula (3); -   (iiia) one or more hydrogen atoms bonded to one or more R^(Xa-d)     non-binding carbon atoms are not replaced; R^(Xa) of R^(Xa), R^(Xb),     R^(Xc), and R^(Xd) is a hydrogen atom; and R^(Xb), R^(Xc), and     R^(Xd) are groups of the formula (3); or -   (iva) one or more hydrogen atoms bonded to one or more R^(Xa-d)     non-binding carbon atoms are not replaced; and all of R^(Xa),     R^(Xb), R^(Xc), and R^(Xd) are groups of the formula (3).

In the case of (iia), preferable examples of the epoxy resin represented by the formula (1) include an epoxy resin represented by the following formula (1-iia):

wherein X^(ii) is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2^(g)-iia):

wherein Y is as defined above; and

-   R¹, R², R³, m, and n are as defined above. -   R¹, R², R³, m, and n each may be the same or different, and are     preferably the same.

The divalent group represented by X^(ii) is preferably a cyclohexane-1,4-diyl group or a 1,4-phenylene group; and more preferably a 1,4-phenylene group.

Preferable among the divalent groups represented by the formula (2^(g)-iia) is a group represented by the formula (2^(g)-iia′):

wherein Y is as defined above.

In the formula (2^(g)-iia′), Y is preferably a bond, a dimethylmethylene group, an oxygen atom, or —SO₂—.

X^(ii) is preferably a cyclohexane-1,4-diyl group, a 1,4-phenylene group, or a group of the formula (2^(g)-iia′); and more preferably a 1,4-phenylene group.

The present invention can more preferably use, for example, an epoxy resin represented by the formula (1-iia), wherein m is the same and is 0, 1, 2, 3, or 4 (particularly preferably m is the same and is 0 or 4); n is the same and is 0 (that is, the ring is not substituted with R³); X^(ii) is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring (particularly preferably a benzene ring); R¹ is the same and is a C₁₋₃ alkyl group; and R² is the same and is a C₂₋₆ alkylene group, wherein one carbon atom that is not directly bonded to the silicon atom, and the 3- to 6-membered ring or epoxy ring may be replaced by an oxygen atom.

In the case of (iiia), the epoxy resins represented by the formula (1) preferably include an epoxy resin represented by the following formula (1-iiia):

wherein is a trivalent group obtained by removing three hydrogen atoms from a hydrocarbon ring, or a trivalent group represented by the formula (2-iiia):

wherein Y is as defined above; and

-   R¹, R², R³, m, and n are as defined above. -   R¹, R², R³, m, and n each may be the same as different, and are     preferably the same.

Preferable examples of the trivalent group represented by include the following groups:

Preferable among the trivalent groups represented by the formula (2^(g)-iiia) include a group represented by the formula (2^(g)-iiia′):

wherein Y is as defined above.

In the formula (2-iiia′), Y is particularly preferably a bond, a dimethylmethylene group, an oxygen atom, or —SO₂—.

The present invention can more preferably use, for example, an epoxy resin represented by the formula (1-iiia), wherein m is the same and is 0, 1, 2, 3, or 4 (particularly preferably m is the same and is 0 or 4); n is the same and is 0 (that is, the ring is not substituted with R³); X^(iii) is a trivalent group obtained by removing three hydrogen atoms from a hydrocarbon ring (particularly preferably a benzene ring); R¹ is the same and is a C₁₋₃ alkyl group; and R² is the same and is a C₂₋₆ alkylene group, wherein one carbon atom that is not directly bonded to the silicon atom and the 3- to 6-membered ring or epoxy ring may be replaced by an oxygen atom.

In the case of (iva), the epoxy resins represented by the formula (1) include an epoxy resin represented by the following formula (1-iva):

wherein X^(iv) is a tetravalent group represented by the above formula (1′), wherein one or more hydrogen atoms bonded to one or more R^(Xa-d) non-binding carbon atoms in the X ring are not replaced; and R¹, R², R³, m, and n are as defined above.

-   R¹, R², R³, m, and n each may be the same or different, and are     preferably the same.

Preferable examples of the tetravalent group represented by X^(iv) include the following groups:

As the tetravalent group represented by X^(iv), among tetravalent groups represented by the formula (2^(g)), wherein one or more hydrogen atoms bonded to one or more R^(Xa-d) non-binding carbon atoms are not replaced, preferable is a group represented by the formula (2^(g)-iva′):

wherein Y is as defined above.

In the formula (2^(g)-iva′), Y is particularly preferably a bond, a dimethylmethylene group, an oxygen atom, or —SO₂—.

The present invention can more preferably use, for example, an epoxy resin represented by the formula (1-iva), wherein m is the same and is 0, 1, 2, 3, or 4 (particularly preferably m is the same and is 0 or 4); n is the same and is 0 (that is, the ring is not substituted with R³); X^(iv) is a tetravalent group obtained by removing four hydrogen atoms from a hydrocarbon ring (particularly preferably a benzene ring); R¹ is the same and is a C₁₋₃ alkyl group; and R² is the same and is a C₂₋₆ alkylene group, wherein one carbon atom that is not directly bonded to the silicon atom and the 3- to 6-membered ring or epoxy ring may be replaced by an oxygen atom.

More preferable among the epoxy resins represented by the formula (1) are specifically, for example, compounds represented by the formula (1-IIa):

wherein R¹, R², and X^(ii) are as defined above.

Preferable among the compounds represented by the formula (1-IIa) are compounds wherein X^(ii) is a 1,4-phenylene group or a group represented by the formula (2^(g)-iia′) (preferably a 1,4-phenylene group); R¹ is the same or different (preferably the same), and is a C₁₋₃ alkyl group (particularly a methyl group); and R² is the same or different (preferably the same), and is a C₂₋₆ alkylene group, (*)—(CH₂)₂—O—CH₂—, (*)—(CH₂)₃—O—CH₂—, (*)—(CH₂)₃—O—(CH₂)₂—, or (*)—(CH₂)₅—O—(CH₂)₄—. (*) represents the side of R² binding to the silicon atom, as described above.

More preferable among the epoxy resins represented by the above formula (1-IIa) is:

an epoxy resin represented by the formula (1-iia1):

wherein R¹ and X^(ii) are as defined above; or

an epoxy resin represented by the formula (1-IIa2):

wherein R¹ and are as defined above.

-   R¹ may be the same or different, and is preferably the same.

More preferably, in the formula (1-IIa1) or (1-IIa2), R¹ is the same or different (preferably the same), and is a C₁₋₃ alkyl group (particularly a methyl group); and is a 1,4-phenylene group or a group represented by the formula (2-iia′).

More preferable among the epoxy resins represented by the formula (1) include an epoxy resin represented by the formula (1-IIb);

wherein R¹, R², R³, and n are as defined above.

-   R¹, R², R³, and n each may be the same or different, and are     preferably the same.

More preferably, in the formula (1-IIb), X^(ii) is a 1,4-phenylene group or a group represented by the formula (2^(g)-iia′) (preferably a 1,4-phenylene group); R¹ is the same or different (preferably the same), and is a C₁₋₃ alkyl group (particularly a methyl group); both n is 0 (that is, the ring is not substituted with R³); and R² is the same or different (preferably the same), and is a C₂₋₆ alkylene group (preferably a di ethylene group: —(CH₂)₂—).

More preferable among the epoxy resins represented by the formula (1) is an epoxy resin represented by the formula (1-IIIa):

wherein R¹, R², R³, X^(iii), and n are as defined above.

-   R¹, R², R³, and n each may be the same or different, and are     preferably the same.

More preferably, in the formula (1-IIIa), X^(iii) is

or a group represented by the formula (2^(g)-iiia′); R¹ is the same or different (preferably the same), and is a C₁₋₃ alkyl group (particularly a methyl group); both n is 0 (that is, the ring is not substituted with R³); and R² is the same or different (preferably the same), and is a C₂₋₆ alkylene group (preferably a dimethylene group: —(CH₂)₂—).

In the epoxy resin composition of the present invention, the epoxy resins represented by the formula (1) can be used singly or in combination of two or more.

The epoxy resin represented by the formula (1) can be produced by or according to a known method, for example, based on or according to the disclosure of PTL 2 (GB1123960B). Moreover, the epoxy resin represented by the formula (1-iia) can be produced by, for example, a reaction represented by the following reaction formula:

wherein R^(2A) is a C₂₋₁₈ alkenyl group, wherein one or more carbon atoms of this group may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; and R¹, R², R³, and are as defined above.

The C₂₋₁₈ alkenyl group represented by R^(2A) is a linear or branched alkenyl group, and preferably a linear alkenyl group. Specific examples include a vinyl group, an allyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a norbornenyl group, a cyclohexenyl group, and the like. A C₂₋₁₀ alkenyl group is preferable; a C₂₋₈ alkenyl group is more preferable; a C₂₋₆ alkenyl group is even more preferable; and a vinyl group, an allyl group, or a butenyl group is particularly preferable. The alkenyl group is preferably an α-alkenyl group.

One or more carbon atoms of these C₂₋₁₈ alkylene groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom, (preferably an oxygen atom). The one or more carbon atoms are preferably carbon atoms that are not directly bonded to the epoxy ring. Moreover, the one or more carbon atoms that may be replaced are one or plural (e.g., 2, 3, 4, 5, or 6) carbon atoms, and preferably one carbon atom. Examples of this group include C₂₋₉ alkenyl-O—C₁₋₈ alkylene-, preferably C₂₋₄ alkenyl-O—C₁₋₃ alkylene-, more preferably C₂₋₄ alkenyl-O—C₁₋₂ alkylene-, and particularly preferably C₃ alkenyl-O—CH₂—. Specific examples include CH₂═CH—O—CH₂—, CH₂═CH—CH₂—O—CH₂—, CH₂═CH—CH₂—O—(CH₂)₂—, CH₂═CH—(CH₂)₃—O—(CH₂)₄—, and the like; among these, CH₂═CH—CH₂—O—CH₂-(allyloxymethyl group) is preferable.

The epoxy, resin represented by the formula (1-iia) can be produced by hydrosilylation of the compound represented by the formula (5-iia) and the compound represented by the formula (6). Hydrosilylation can be generally performed in the presence of a catalyst in the presence or absence of a solvent. Moreover, when a compound represented by the formula (5-iiia):

wherein R¹ and X^(iii) are as defined above; or the formula. (5-iv)

wherein R¹ and X^(iii) are as defined above; or the formula (5-ia):

wherein X^(i) is a monovalent group obtained by removing one hydrogen atom from a hydrocarbon ring, and R¹ is as defined above; is used in place of the compound represented by the formula (5-iia), an epoxy resin represented by the above formula (1-iiia) or (1-iva), or an epoxy resin having a structure in which one group of the formula (3) is bonded to a hydrocarbon ring can also be produced. Moreover, various compounds represented by the formula (1) can be produced by using compounds having a structure in which X^(i) to X^(iv) are each replaced by a monovalent group obtained by removing one hydrogen atom from the X ring, a divalent group obtained by removing two hydrogen atoms from the X ring, a trivalent group obtained by removing three hydrogen atoms from the X ring, or a tetravalent group obtained by removing four hydrogen atoms from the X ring.

The catalyst used in hydrosilylation may be a known catalyst. Examples include platinum-based catalysts, such as platinum carbon, chloroplatinic acid, olefin complexes of platinum, alkenylsiloxane complexes of platinum, and carbonyl complexes of platinum; rhodium-based catalysts, such as tris (triphenylphosphine) rhodium; and iridium-based catalysts, such as bis(cyclooctadienyl)dichloroiridium. These catalysts may be the form of solvates (e.g., hydrates, alcoholates, etc.). Further, the catalyst may be used in the form of a solution obtained by dissolving the catalyst in an alcohol (e.g., ethanol) when used. These catalysts can be used singly or in combination of two or more.

The amount of the catalyst used may be an effective amount as the catalyst. For example, the amount of the catalyst used is generally 0.00001 to 20 parts by mass, and preferably 0.0005 to 5 parts by mass, based on the total amount of 100 parts by mass of the compound represented the formula (5-ia), (5-iia), (5-iiia), or (5-iva), and the compound represented by the formula (6).

Although hydrosilylation proceeds without use of a solvent, the reaction can be carried out under milder conditions by using a solvent. Examples of solvents include aromatic hydrocarbon solvents, such as toluene and xylene; aliphatic hydrocarbon solvents, such as hexane and octane; ether solvents, such as tetrahydrofuran and dioxane; alcohol solvents, such as ethanol and isopropanol; and the like. These may be used singly or in combination of two or more.

The amount of the compound represented by the formula (6) is, for example, generally 0.5 to 2 mol, preferably 0.6 to 1.5 mol, and more preferably 0.8 to 1.2 mol, per mol of the Si—H group in the compound represented by the formula (5-ia), (5-iia), (5-iiia), or (5-iva).

The reaction temperature is generally 0° C. to 150° C., and preferably 10° C. to 120° C. The reaction time is generally about 1 hour to 24 hours.

After completion of the reaction, the solvent is distilled off from the reaction mixture, or a known isolation method is used, thereby obtaining an epoxy resin represented by the formula (1).

Preferable examples of the polyphenylene ether used in the present invention include those containing a repeating structure of a phenylene ether represented by the following formula (7):

In the formula (7), R⁴ is the same or different, and is a hydrogen atom, a halogen atom, a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom.

The C₁₋₁₈ alkyl group, C₂₋₉ alkenyl group, cycloalkyl group, aryl group, or aralkyl group represented by R⁴ is the same as the substituent represented by R¹ mentioned above.

Preferable examples of the repeating structure of the phenylene ether represented by the formula (7) include a repeating structure represented by the following formula (7a):

wherein R^(4a) is the same or different, and is a C₁₋₁₈ alkyl group in the formula (7a), R^(4a) is preferably the same. Moreover, the C₁₋₁₈ alkyl group represented by R^(4a) is preferably a C₁₋₁₀ alkyl group, more preferably a C₁₋₆ alkyl group, and even more preferably a C₁, C₂, C₃, or C₄ alkyl group.

The molecular weight of the polyphenylene ether is preferably 500 to 200000, more preferably 1000 to 100000, and even more preferably 1000 to 80000.

For example, when the resin composition of the present invention is used for a rigid printed circuit board or prepreg, the molecular weight of the polyphenylene ether is particularly preferably 500 or more and less than 5000. Moreover, for example, when the resin composition of the present invention is used for an adhesive layer or a film, the molecular weight of the polyphenylene ether is preferably 5000 to 200000, in terms of the flexibility of the film, etc.

When a polyphenylene ether having a molecular weight of less than 5000 (particularly 500 or more and less than 5000) is used, one that is reactive with epoxy resins is preferable, in terms of heat resistance. Polyphenylene ethers having a reactive functional group at their molecular chain end are preferable. For example, polyphenylene ethers having a phenolic hydroxyl group or an unsaturated bond group are preferable; and polyphenylene ethers having a reactive functional group at both ends are more preferable, in terms of crosslinking properties and heat resistance. The reactive functional group equivalent of the polyphenylene ether in this case is preferably about 200 to 5000 g/eq, more preferably 300 to 2500 g/eq, and even more preferably 400 to 2000 g/eq. If the reactive functional group (particularly hydroxyl group) equivalent is larger than 5000 g/eq, the degree of crosslinking of the cured product is insufficient, and the characteristics, such as heat resistance, may be inferior.

The mixing ratio of the polyphenylene ether used in the present invention is not particularly limited within a range in which the effects of the present invention can be exhibited.

The mixing ratio of the epoxy resin to the polyphenylene ether in the present invention is, by mass ratio, for example, preferably 20:1 to 1:50, and more preferably 10:1 to 1:30.

Moreover, particularly when a polyphenylene ether having a molecular weight of less than 5000 (particularly 500 or more and less than 5000) is used, one that is reactive with epoxy resins is preferable. The mixing ratio of the epoxy resin to the polyphenylene ether is, for example, such that the equivalent ratio of epoxy groups in the epoxy resin to reactive functional groups in the polyphenylene ether (epoxy groups/reactive functional groups in the polyphenylene ether) is preferably 0.1 to 10, more preferably 0.15 to 6, and even more preferably 0.2 to 3. When the equivalent ratio is within this range, the reactive functional groups in the polyphenylene ether can be more efficiently reacted. When the equivalent ratio is 10 or less, dielectric characteristics can be further improved. Moreover, when the equivalent ratio is 0.1 or more, the reaction between the epoxy resin and the polyphenylene ether sufficiently proceeds, and heat resistance etc. are further improved.

The polyphenylene ethers as mentioned in the present specification also include those called “modified polyphenylene ethers” in this technical field. Polyphenylene ethers in a narrow sense sometimes refer to those comprising a repeating structure represented by the formula (7a) wherein R^(4a) is the same and is a methyl group; however, the polyphenylene ethers in the present specification are not limited thereto.

Among polyphenylene ethers having a repeating structure of the phenylene ether represented by the formula (7a), for example, a polyphenylene ether represented by the following formula can be preferably used in the present invention.

wherein R^(4a) is the same or different, and is as defined above; X^(ppe) is the same or different, and is a hydrogen atom or a group represented by the formula:

Y^(ppe) is a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group; and m^(ppe) and n^(ppe) are 2 to 60 in total.

Y^(ppe) is preferably a C₁₋₆ alkylene group substituted with a C₁₋₄ alkyl group, more preferably a C₁₋₄ alkylene group substituted with two C₁₋₄ alkyl groups, and even more preferably a C₁ or C₃ alkylene group substituted with two methyl groups. Specific examples include —CH(CH₃)—, —C(CH₃)₂—, —CH₂CH(CH₃)CH₂—, —CH₂C(CH₃)₂CH₂—, and the like. A dimethylmethylene group is most preferable.

m^(ppe) and n^(ppe) are preferably 2 to 55 in total, and more preferably 2 to 50 in total. m^(ppe) is preferably 1 to 30. n^(ppe) is preferably 1 to 30. More preferably, m^(ppe) is 1 to 25, and n^(ppe) is 1 to 25.

Moreover, among polyphenylene ethers having a repeating structure of the phenylene ether represented by the formula (7a), for example, a polyphenylene ether represented by the following formula:

wherein R^(4a) is the same or different, and is as defined above; and l^(ppe) is about 1 to 500;

-   can also be preferably used in the present invention. Although it is     not particularly limited, the upper limit of l^(ppe) may be 400,     300, 200, 100, or 50.

As the polyphenylene ether, generally commercially available products may be used. Examples include OPE-1000 and OPE-2000 (bifunctional polyphenylene ethers), OPE-2Gly (an epoxy-modified polyphenylene ether), OPE-2st (a styrene-modified polyphenylene ether), and OPE-2EA (an acrylic-modified polyphenylene ether), all of which are produced by Mitsubishi Gas Chemical Co., Inc; SA120 (a polyphenylene ether), SA90 (a bifunctional polyphenylene ether), SA9000 (a methacrylic-modified polyphenylene ether), and PPO630, PPO640, PPO646, PPO800, PPO803, and PPO808 (polyphenylene ethers), all of which are produced by SABIC; Xyron S201A and Xyron S202A (polyphenylene ethers), all of which are produced by Asahi Kasei Chemicals; and the like. Further, known polyphenylene ethers can also be used within a range that does not impair the effects of the present invention. Preferable examples of known polyphenylene ethers include the polyphenylene ether disclosed in WO2014/034103. The contents disclosed in the specification and/or drawings of WO2014/034103 are incorporated into the present specification by reference.

In the epoxy resin composition of the present invention, the polyphenylene ethers can be used singly or in combination of two or more.

The epoxy resin composition of the present invention may contain an epoxy resin other than the epoxy resin represented by the formula (1) within a range that does not impair the effects of the present invention. Examples of other epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolak epoxy resins, cresol novolak epoxy resins, cycloaliphatic epoxy resins, brominated epoxy resins, triglycidyl isocyanurate, hydrogenated bisphenol A epoxy resins, aliphatic epoxy resins, glycidyl ether epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, dicyclo epoxy resins, naphthalene epoxy resins, and the like. These epoxy resins may be used singly or in combination of two or more.

When an epoxy resin other than the epoxy resin represented by the formula (1) is mixed, the mixing ratio of the epoxy resin represented by the formula (1) to the epoxy resin other than the epoxy resin represented by the formula (1) is, by mass ratio, for example, 100:0 to 20:80, preferably 100:0 to 30:70, and more preferably 100:0 to 40:60.

The epoxy resin composition of the present invention may contain, if necessary, fillers, curing agents, curing catalysts, thermoplastic resins, additives, etc., within a range that does not impair the objects and effects of the present invention.

Examples of fillers include inorganic compounds, such as silica (specifically crystalline silica, fused silica, spherical fused silica, etc.), titanium oxide, zirconium oxide, zinc oxide, tin oxide, silicon nitride, silicon carbide, boron nitride, calcium carbonate, calcium silicate, potassium titanate, aluminum nitride, indium oxide, alumina, antimony oxide, cerium oxide, magnesium oxide, iron oxide, and tin-doped indium oxide (ITO). Other examples include metals, such as gold, silver, copper, aluminum, nickel, iron, zinc, and stainless steel. Still other examples include minerals, such as montmorillonite, talc, mica, boehmite, kaolin, smectite, zonorite, vermiculite, and sericite. Examples of other fillers include carbon compounds, such as carbon black, acetylene black, Ketchen black, and carbon nanotubes; metal hydroxides, such as aluminum hydroxide and magnesium hydroxide; various types of glass, such as glass beads, glass flakes, and glass balloons; and the like. The filler may be used in a powder form, or may be used after being dispersed in a resin. The above fillers can be used singly or in combination of two or more, in consideration of flowability, heat resistance, low thermal expansion properties, mechanical characteristics, hardness, scratch resistance, adhesion, etc., which are required for compositions and cured products.

Examples of curing agents include amine-based curing agents, amide-based curing agents, acid anhydride-based curing agents, phenol-based curing agents, mercaptan-based curing agents, isocyanate-based curing agents, active ester-based curing agents, cyanate ester-based curing agents, and the like. The curing agents may be used singly, or in combination of two or more because they can be properly used corresponding to the required characteristics.

Examples of amine-based curing agents include chain aliphatic amines, such as ethylenediamine, diethylenetriamine, triethylenetetramine, and tetraethylenepentamine; alicyclic amines, such as isophoronediamine, benzenediamine, bis(4-aminocyclohexyl)methane, bis(aminomethyl)cyclohexane, and diaminodicyclohexylmethane; aromatic amines, such as metaphenylenediamine, diaminodiphenylmethane, diethyltoluenediamine, and diaminodiethyldiphenylmethane; secondary and tertiary amines, such as benzyldimethylamine, triethylenediamine, piperidine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, DBU (1,8-diazabicyclo(5,4,0)-undecene-7), DEN (1,5-diazabicyclo(4,3,0)-nonene-5), and the like.

Examples of amide-based curing agents include dicyandiamide and derivatives thereof, polyamide resins (e.g., polyaminoamide), and the like.

Examples of acid anhydride-based curing agents include aliphatic acid anhydrides, such as maleic anhydride and dodecenylsuccinic anhydride; aromatic acid anhydrides, such as phthalic anhydride, trimellitic anhydride, and pyromellitic dianhydride; alicyclic acid anhydrides, such as methylnadic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and 4-methylhexahydrophthalic anhydride; and the like.

Examples of phenol-based curing agents include phenol novolak resins, cresol novolak resins, biphenyl-type novolak resins, triphenylmethane-type phenol resins, naphthol novolak resins, phenol biphenylene resins, phenol aralkyl resins, biphenylaralkyl phenol resins, modified polyphenylene ether resins, compounds having a benzoxazine ring, and the like.

Examples of mercaptan-based curing agents include trimethylolpropane tris(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis(3-mercaptopropionate), tetraethyleneglycol bis(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolpropane tris(3-mercaptobutyrate), trimethylolethane tris(3-mercaptobutyrate), polysulfide polymers, and the like.

Examples of isocyanate-based curing agents include hexamethylene diisocyanate, 1,4-tetramethylene diisocyanate, 2-methylpentane-1,5-diisocyanate, lysine diisocyanate, isophorone diisocyanate, norbornane diisocyanate, and the like.

Examples of active ester-based curing agents include compounds having, per molecule, one or more ester groups reactive with epoxy resins. Specific examples include phenol esters, thiophenol esters, N-hydroxyamine esters, heterocyclic ring hydroxy compound esters, and the like.

Examples of curing catalysts include imidazole compounds, dicyandiamide, tertiary amine, phosphorus-based compounds, Lewis acid compounds, cationic initiators, and the like. The curing catalysts may be used singly, or in combination of two or more because they can be properly used corresponding to the required characteristics.

Examples of thermoplastic resins include polyolefin resins, acrylic resins, phenoxy resins, polyamide resins, polyester polycarbonate resins, polyurethane resins, polyarylate resins, polyacetal resins, acid-modified products thereof, and the like. In terms of compatibility with the epoxy resin composition of the present invention and heat resistance, polyolefin resins, acrylic resins, phenoxy resins, polyarylate resins, and acid-modified products thereof are preferable; and more preferable among these are polyolefin resins and acid-modified polyolefin resins. The thermoplastic resins can be used singly or in combination of two or more.

Examples of additives include antioxidants, inorganic fluorescent substances, lubricants, ultraviolet absorbers, heat light stabilizers, antistatic agents, polymerization inhibitors, antifoaming agents, solvents, anti-aging agents, radical inhibitors, adhesion-improving agents, flame retardants, surfactants, storage stability-improving agents, ozone aging inhibitors, thickeners, plasticizers, radiation-blocking agents, nucleating agents, coupling agents, conductivity-imparting agents, phosphorus-based peroxide-decomposing agents, pigments, metal deactivators, physical property-controlling agents, and the like.

The epoxy resin composition of the present invention can be produced by mixing the epoxy resin represented by the formula (1) and a polyphenylene ether, and further optionally other components. The mixing method is not particularly limited, as long as it allows uniform mixing. The epoxy resin composition of the present invention may contain a solvent (e.g., toluene, xylene, methyl ethyl ketone, acetone, cyclohexanone, methylcyclohexane, or cyclohexane) within a range that does not adversely affect the effects of the present invention.

A cured product can be obtained by curing the epoxy resin composition of the present invention (i.e., a cured product of the epoxy resin composition). As the curing method, for example, the composition can be cured by heating. The curing temperature is generally room temperature to 250° C. The curing time varies depending on the composition, and can be generally widely set from 30 minutes to 1 week.

A cured product obtained by curing the epoxy resin composition of the present invention has excellent electric characteristics and high adhesive strength to metal. Accordingly, the epoxy resin composition of the present invention can be preferably used for various applications, such as semiconductor sealing materials, liquid sealing materials, potting materials, sealing materials, interlayer insulation films, adhesive layers, coverlay films, electromagnetic shielding films, printed circuit board materials, and composite materials.

In the present specification, the term “comprising” includes “consisting essentially of” and “consisting of.”

EXAMPLES

The present invention is described in more detail below with reference to Examples; however, the present invention is not limited to only these Examples.

Production Example 1 Production of Epoxy Resin A

Allyl glycidyl ether (5.9 g), 0.05 g of 2 wt % ethanol solution of hexachloroplatinic acid hexahydrate, and 100 g of toluene were placed in a 200-mL four-necked flask equipped with a stirrer, a thermometer, and a condenser in a nitrogen atmosphere, and the liquid temperature was raised to 70° C. Thereafter, 5.0 g of 1,4-bis(dimethylsilyl)benzene was added dropwise for 15 minutes, and the mixture was then stirred at 90° C. for 4 hours. After the toluene was removed by concentration, 10.3 g (epoxy equivalent: 211 g/eq) of 1,4-bis[(2,3-epoxypropyloxypropyl)dimethylsilyl]benzene (epoxy resin A) was obtained as a colorless, transparent liquid.

Production Example 2 Production of Epoxy Resin B

1,2-Epoxy-5-hexene (5.0 g), 0.05 g of 2 wt % ethanol solution of hexachloroplatinic acid hexahydrate, and 100 g of toluene were placed in a 200-mL four-necked flask equipped with a stirrer, a thermometer, and a condenser in a nitrogen atmosphere, and the liquid temperature was raised to 70° C. Thereafter, 5.0 g of 1,4-bis(dimethylsilyl)benzene was added dropwise for 15 minutes, and the mixture was then stirred at 90° C. for 5 hours. After the toluene was removed by concentration, 9.5 g (epoxy equivalent: 195 q/eq) of 1,4-bis[(2,3-epoxybutyl)dimethylsilyl]benzene (epoxy resin B) was obtained as a colorless, transparent liquid.

Production Example 3 Production of Epoxy Resin C

1,2-Epoxy-4-vinylcyclohexane (6.4 g), 0.05 g of 2 wt % ethanol solution of hexachloroplatinic acid hexahydrate, and 100 g of toluene were placed in a 200-mL four-necked flask equipped with a stirrer, a thermometer, and a condenser in a nitrogen atmosphere, and the liquid temperature was raised to 70° C. Thereafter, 5.0 g of 1,4-bis(dimethylsilyl)benzene was added dropwise for 15 minutes, and the mixture was then stirred at 90° C. for 4 hours. After the toluene was removed by concentration, 10.8 g (epoxy equivalent: 221 g/eq) of 1,4-bis{[2-(3,4-epoxycyclohexyl)ethyl]dimethylsilyl}benzene (epoxy resin C) was obtained as a colorless, transparent liquid.

Production Example 4 Production of Epoxy Resin D

1,2-Epoxy-4-vinylcyclohexane (4.3 g), 0.05 g of 2 wt % ethanol solution of hexachloroplatinic acid hexahydrate, and 250 g of toluene were placed in a 200-mL four-necked flask equipped with a stirrer, a thermometer, and a condenser in a nitrogen atmosphere, and the liquid temperature was raised to 70° C. Thereafter, 5.0 g of bis[(p-dimethylsilyl)phenyl]ether was added dropwise for 15 minutes, and the mixture was then stirred at 90° C. for 6 hours. After the toluene was removed by concentration, 8.9 g (epoxy equivalent: 267 g/eq) of 4,4′-bis{[2-(3,4-epoxycyclohexyl)ethyl]dimethylsilyl}diphenyl ether (epoxy resin D) was obtained as a colorless, transparent liquid.

Production Example 5 Production of Epoxy Resin E

1,2-Epoxy-4-vinylcyclohexane (7.4 g), 0.05 g of 2 wt % ethanol solution of hexachloroplatinic acid hexahydrate, and 250 g of toluene were placed in a 200-mL four-necked flask equipped with a stirrer, a thermometer, and a condenser in a nitrogen atmosphere, and the liquid temperature was raised to 70° C. Thereafter, 5.0 g of 1,3,5-tris(dimethylsilyl)benzene was added dropwise for 15 minutes, and the mixture was then stirred at 90° C. for 6 hours. After the toluene was removed by concentration, 11.8 g (epoxy equivalent: 208 g/eq) of 1,3,5-tris{[2-(3,4-epoxycyclohexyl)ethyl]dimethylsilyl}benzene (epoxy resin E) was obtained as a colorless, transparent liquid.

Examples and Comparative Examples

Components in amounts (mass ratio) shown in Tables 1 and 2 were weighed in a cup and starred with a magnetic stirrer for 5 minutes while warming at 100° C., thereby preparing epoxy resin compositions.

The components in Tables 1 and 2 are as follows. The numerical value of each component an Tables 1 and 2 represents part by mass.

-   -   Epoxy resin F: Bis-A epoxy resin (Grade 828), produced by         Mitsubishi Chemical Corporation (epoxy equivalent: 189 g/eq)     -   Epoxy resin G: cycloaliphatic epoxy resin, produced by Daicel         Corporation (Celloxide 20219; general name:         3′,4′-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate)         (epoxy equivalent: 137 g/eq)     -   Polyphenylene ether A: bifunctional polyphenylene ether         (OPE-1000, produced by Mitsubishi Gas Chemical Co., Inc.),         molecular weight, 1000 (functional group equivalent: 422 g/eq)     -   Polyphenylene ether B: styrene-modified polyphenylene ether         (OPE-1200st, produced by Mitsubishi Gas Chemical Co., Inc.),         molecular weight: 1200 (functional group equivalent: 670 g/eq)     -   Polyphenylene ether C: polyphenylene ether (SA-90, produced by         SABIC), molecular weight: 1700 (functional group equivalent 840         g/eq)     -   Polyphenylene ether D: PPO630, produced by SABIC (molecular         weight: 34000) (functional group equivalent: 34000 g/eq)     -   Polyphenylene ether E: Byron S201A, produced by Asahi Kasei         Corporation (molecular weight: 19000) (functional group         equivalent: 19000 g/eq)     -   Polyphenylene ethers D and E are both         poly(2,6-dimethyl-,1,4-phenylene ether).     -   Curing agent A: acid anhydride-based curing agent (MH 700,         produced by New Japan Chemical Co., Ltd.)     -   Curing catalyst A: imidazole-based curing catalyst (EMI24,         produced by Mitsubishi Chemical Corporation)     -   Curing catalyst B: cationic polymerization initiator (SAN-AID         SI-100L, produced by Sanshin Chemical Industry Co., Ltd.)     -   Thermoplastic resin A: acid-modified polyolefin resin (Tuftec         M1913, produced by Asahi Kasei Corporation); maleic         anhydride-modified hydrogenated SEBS         (styrene-ethylene-butylene-styrene copolymer)

Test Example

(1) 90-Degree Peel Strength against Copper Foil

The epoxy resin compositions obtained in the Examples and Comparative Examples were each applied to an aluminum plate, and a 35-μm-thick electrolytic copper foil (produced by Furukawa Electric Co., Ltd.) was superimposed thereon. The resulting products were cured by heating at 100° C. for 1 hour, 120° C. for 2 hours, and 150° C. for 2 hours. After curing, cuts with a width of 1 cm were made with a cutter, thereby preparing 90-degree peel strength test pieces. The obtained test pieces were each subjected to a 90-degree peel strength test using AGS-X (produced by Shimadzu Corp.) at a test rate of 50 mm/min. Tables 1 and 2 show the results.

(2) Electric Characteristics (Relative Dielectric Constant and Dielectric Loss Tangent)

The epoxy resin compositions obtained in the Examples and Comparative Examples were each poured into a resin mold (thickness: 2 cm), and cured by heating at 100° C. for 1 hour, 120° C. for 2 hours, and 150° C. for 2 hours. Subsequently, the cured products were each cut into size of 20 mm width×30 mm length×2 nm thickness. Thus, test pieces for dielectric measurement were obtained.

The relative dielectric constant (1 GHz) and the dielectric loss tangent (1 GHz) of each of the obtained test pieces were measured using a dielectric constant measuring device (Impedance Analyzer, produced by Agilent) at 25° C. The dielectric constant measuring device was calibrated with PTFE. Tables 1 and 2 show the results.

TABLE 1 Example 1 2 3 4 5 6 7 8 9 10 11 12 Epoxy resin A 10 10 B 10 10 C 10 10 10 10 10 10 D 10 E 10 Polyphenylene A 30 30 30 ether resin B 40 C 30 30 90 D 30 4 E 30 30 30 Curing agent A 7 7 7 7 7 6 7 7 Curing catalyst A 0.1 0.1 0.1 0.1 0.1 01 0.1 0.1 0.1 0.1 0.1 B 0.1 Thermoplastic A 90 resin Copper foil 9 9 8 8 8 8 8 10 8 8 8 7 peel strength (N/cm) Relative 2.6 2.6 2.5 2.5 2.6 2.6 2.5 2.7 2.5 2.6 2.6 2.5 dielectric constant (1 GHz) Dielectric loss 0.005 0.003 0.003 0.003 0.003 0.003 0.003 0.004 0.003 0.003 0.003 0.002 tangent (1 GHz)

TABLE 2 Comparative Example 1 2 3 4 5 Epoxy resin F 10 10 G 10 10 10 Polyphenylene ether A 30 30 resin B 30 C 30 D 30 Curing agent A 8 11 Curing catalyst A 0.1 0.1 0.1 0.1 B 0.1 Copper foil peel 6 5 5 6 5 strength (N/cm) Relative dielectric 2.8 2.9 2.9 2.8 2.9 constant (1 GHz) Dielectric loss 0.01 0.012 0.012 0.01 0.011 tangent (1 GHz) 

The invention claimed is:
 1. An epoxy resin composition comprising an epoxy resin and a polyphenylene ether, the epoxy resin being represented by the formula (1):

wherein X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, or in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected; R^(Xa), R^(Xb), R^(Xc), and R^(Xd) are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyl group, a halogen atom, or a group represented by the formula (3):

wherein R¹ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; R² is a C₁₋₁₈ alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; R³ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; m is an integer of 0 to 6; and n is an integer of 0 to 3; provided that at least one of R^(Xa), R^(Xb), R^(Xc), and R^(Xd) is a group represented by the formula (3); and one or more hydrogen atoms bonded to one or more carbon atoms that constitute the hydrocarbon ring constituting the X ring, and that are not bonded to R^(Xa), R^(Xb), R^(Xc), or R^(Xd), may be replaced by a lower alkyl group, a lower alkoxy group, a lower alkenyl group, or a halogen atom.
 2. The epoxy resin composition according to claim 1, wherein the rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected are rings represented by the formula (2):

wherein X¹ ring and X² ring are the same or different, and each is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring; and Y is a bond, a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO₂—.
 3. The epoxy resin composition according to claim 1, wherein the saturated hydrocarbon ring is a C₄₋₈ saturated hydrocarbon ring, and the unsaturated hydrocarbon ring is a C₄₋₈ unsaturated hydrocarbon ring.
 4. The epoxy resin composition according to claim 1, wherein the epoxy resin is at least one epoxy resin selected from the group consisting of: an epoxy resin represented by the formula (1-iia):

wherein X^(ii) is a divalent group obtained by removing two hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a divalent group represented by the formula (2^(g)-iia):

wherein Y is a bond, a C₁₋₆ alkylene group that may be substituted with a C₁₋₄ alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO₂—; R¹ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; R² is the same or different, and is a C₁₋₁₈ alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; R³ is the same or different, and is a C₁₋₁₈ alkyl group, a C₂₋₉ alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom; m is an integer of 0 to 6; and n is an integer of 0 to 3; and an epoxy resin represented by the formula (1-iiia):

wherein X^(iii) is a trivalent group obtained by removing three hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a trivalent group represented by the formula (2^(g)-iiia):

wherein Y is as defined above; and R¹, R², R³, m, and n are as defined above.
 5. A cured product of the epoxy resin composition according to claim
 4. 6. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim
 5. 7. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim
 4. 8. The epoxy resin composition according to claim 4, wherein the epoxy resin is at least one epoxy resin selected from the group consisting of: an epoxy resin represented by the formula (1-IIa):

wherein R¹, R², and X^(ii) are as defined above, an epoxy resin represented by the formula (1-IIb):

wherein R¹, R², R³, X^(ii), and n are as defined above, and an epoxy resin represented by the formula (1-IIIa):

wherein R¹, R², R³, X^(iii), and n are as defined above.
 9. A cured product of the epoxy resin composition according to claim
 8. 10. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim
 9. 11. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim
 8. 12. The epoxy resin composition according to claim 1, wherein the polyphenylene ether has a reactive functional group equivalent of 200 to 5,000 g/eq.
 13. A cured product of the epoxy resin composition according to claim
 1. 14. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim
 13. 15. A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim
 1. 